Product Features

1. Using high-performance ultraviolet laser and cold light source,The heat affected zone of laser cutting is particularly small10μmHigh precision scanning galvanometer with high precision and long lifespan;

2. High precision linear motor working platform, with high precision and fast speed;

3. OptionalCCDAutomatic positioning and calibration; Vacuum adsorption fixed plate, no need for alternative fixtures;

4. The processing process is automatically controlled by computer software, and the software interface provides real-time feedback to understand the processing status in real time;

5.The minimum achievable focused spot10μmSuitable for any organic material/Fine cutting and drilling of inorganic materials.

Applications

Widely used for cutting organic and inorganic materials, especially suitable forPCBCutting and dividing boards,FPCCutting, covering film cutting, window opening, silicon wafer cutting/Marking, ceramic cutting/underline/Drilling, glass cutting/underline/Hair removal, fingerprint recognition chip cutting,PETMembrane cutting,PIFilm cutting, ultra-thin metal cutting such as copper foil, drilling, composite material cutting, etc.

Technical Parameter